Designing with the TDK IAM-20680 MEMS Microphone requires careful PCB layout to achieve maximum performance.

Power Supply Management

Stable, low-noise power is critical. Place bypass capacitors close to the IAM-20680’s pins to minimize ripple and interference.

Grounding

A solid ground plane reduces signal distortion. Connect the microphone’s ground directly to the system ground for best results.

Signal Routing

Keep I²C and SPI lines short and shielded from high-current or RF traces. This helps maintain signal integrity.

Mechanical Design

Ensure the microphone’s acoustic port remains unobstructed. Housing design should avoid blocking or distorting sound waves entering the component.

Conclusion

Following PCB best practices ensures the IAM-20680 MEMS Microphone delivers optimal sound quality and system reliability.